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submitted 1 year ago by L4s@lemmy.world to c/technology@lemmy.world

Apple has a memory problem and we're all paying for it::Apple still sells expensive "Pro" computers with just 8GB of RAM and charges a fortune for more.

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[-] just_another_person@lemmy.world 41 points 1 year ago

Memory is memory. Apple's attempt at branding these machines as "different" as if they were more efficient at using that memory, is absolutely fucking stupid. These Pro machines are used for large file operations like videos, and their response is simply "guess you need to pay more".

I feel like they're trying to get back to the PPC days where generally available parts are not cheap. I hope plenty of cheap alternatives show up on Newegg or wherever. Fuck this bullshit.

[-] turkalino@lemmy.yachts 10 points 1 year ago

Memory is memory

Definitely not true hardware-wise. L2 cache is different from DDR3 RAM is different from DDR4 RAM... in price and performance

Software-wise, yes, the operating system abstracts away the differences and memory is memory

Apple's memory upgrade costs are probably 90% usual Apple bullshit pricing, 10% grounded in reality. I'm thinking that the 10% may be something like the motherboards are designed without memory upgrades in mind, so if you want more RAM, they have to use a special mobo which they prefab less of

[-] Earthwormjim91@lemmy.world 3 points 1 year ago

Apple uses a unified memory where the memory chips are embedded on the SoC in the first place. The memory modules are on the same silicon wafer the chip is cut from, not separately on the Mobo, and shared directly with the chip in a single pool of memory that the CPU and GPU can access, rather than dedicated memory for each.

Changing the memory means cutting a different piece of silicon for it.

[-] XGM@lemmy.world 12 points 1 year ago

The SoC and memory are separate dies with different manufacturing processes. In the case of M2 it was TSMC for the SoC and SK Hynix for the memory.

When it comes time to package them together, the SoC and memory are soldered to a interposer layer. So the only difference is which size memory chips they solder together for the different memory configurations available.

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this post was submitted on 10 Nov 2023
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