this post was submitted on 30 Sep 2023
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When developing a product you order "process corner" chips that are primarily used for testing the memory timings (through a process called Shmoo) to make sure it is stable. The "FF" class of these chips are also useful for testing thermals as they draw the maximum power you will see with the silicon lottery. So assuming Apple did this properly they should have had a good idea of what the product temperature is at the operating temperature extremes.
Interesting, so SOP would rule that out too. I didn't know this.